TSCD-II Operating Instructions

I

M PORTANT SAFETY I N FORMATION

The TSCD-ll Sterile Tuhing Welder has been designed for use in the storage and handling of

blood products. lf the instrument or procedures are used for purpose over and above the capabilities specified herein. confirmation of their validity and suitability should be obtained; otherwise the manufacturer will not guarantee the results and assumes no obligation or liability. It is the user's responsibility to follow all procedures outlined in this manual. NOTES, PRECAUTIONS or CAUIONS and WARNINGS within the text of this manual are used to emphasize important and critical instructions. WARN| NG : Informs the operator oI ahazard or an unsafe practice that could result in personal injury, affect the operators health or contaminate the environment.

PRECAUTION or CAUTTON : Includes information regarding any special care to be exercised by the operator for the safe and effective use of the device. NOTE : Highlights essential information. lWnnrutruCSl

. Failure to follow all operating instructions can result in leaking, non-sterile welds, . Check each weld carefully. lf, for any reason, the weld leaks, the sterility of your system may be compromised, resulting in contamination. Handle appropriately.

. The TSCD-l[ is an electro-mechanical instrument designed for reliability. However, electrical or mechanical failures may occur which could result in leaking, non-sterile welds.

. Wafers can be used only once. Wafers cannot be reused. Be sure to dispose of all used wafers properly. Treat wafers that have been used on tubing containing blood products as biological waste, and handle according to proper infectious disposal procedures.

. Be careful not to spill any liquid into the TSCD-ll. Liquid inside the instrument can cause inegular operation and/or incomplete welds.

TABLE OF CONTENTS

IMPORTANT SAFETY INFORMATION...

1

Section 1. Features and Specifications

Features 1.2 Specifications 1.3 Symbols ''1.1

3 3 3

Section 2. Physical Description 2.1 Front of TSCD-ll 2.2 Clamps. 2.3 Rear of TSCD-ll 2.4 Control Panel ...

2.5 Accessories... 2.6 Ootional Accessories...

4 4

... 5 6 6 6

Section 3. Operation of TSCD-ll 3.'1 Principle of

Operation

7

Section 4. GeneralWarnings and Cautions

4.1 General Warnings and Cautions... 4.2 Storage 4.3 Cleaning Procedure 4.4 Periodical Maintenance ... 4.5 Waste and Recycle

8 8 9

I 9

Section 5. Procedures for Use 5.1 Operational Flow Chart... 5.'1 .1 System Set-up 5.1.2 Clamp Alignment... 5.1.3 Tube Placement 5.'1.4 Starting the Weld Cycle ... 5.1.5 Weld Alignment Inspection 5.1 .6 Opening the Weld ... 5.2 Replacing the Wafer Cassette 5.3 Snap on the Blood Bag Support... 5.4 Detachable Cover 5.5 Wafer Disoosal... 5.6 Cleaning Procedure 5.7 Repiacing the Air Fi1ter... 5.8 Parameter Setting Mode...

5.8.1 Lan9ua9e...

S.S.2BuzzerVolume 5.8.3 Date Format 5.8.4Information System Activation 5.8.5 Weld Counter 5.8.6 Exit from Parameter Setting Mode... 5.9 Installing the Wafer jam Repair Too1...

... 10 ...10-1 1

... 11 ... 12

...12 ... 13 ... '13 ... 13

...14 ... 15 ... 16 ... '16

... 17 ... 17

...'.'."' 17 '...'...'... 18 ...'...'... 18 ...' 18 ... '18 ... '18

... 19

Section 6. Troubleshooting 6.1 Prompts on the Display 6.2 Troubleshooting Tab|e... 6.3 Procedure to repair a Wafer jam...

...20-22 ... 23

23-25

Section 7. Technical Support

7.1 Contacting Technical Support

...26

Section 8. Declaration of conformity

...27

2

SeCtiOn 1 . Features and specifications

The Terumo TSCD-ll is a system for automatically connecting in a sterile manner two sections of PVC tubing.

. The TSCD-ll has a compact design and is portable. . The system automatically connects two pieces of tubing in three easy steps. . The system is able to connect two pieces of tubing empty or filled with solution such as blood or medicine. . An LCD display indicates operatrng status, guidance for the operators and error messages. . Wafers are automatically replaced. Used wafers are automatically disposed of into a disposal box without any external contact.

. Wafers are packed in cassettes, which assure easy replacement.

Name of

product

Product code Tubing material

Tubing sizes Wafer used Operating condition

I rrnuvo STERILE TUBING WELDER TSCD-ll

I ME*SC203A I Polyvinyl chloride (PVC)

I Tubing associated with: Blood bags

I I I

Leukocyte reduction filters Apheresis Kits AVF Needles

Outer Diameter 3.9 - 4.5 mm lnner Diameter 2.9 - 3.'1 mm TSCD Wafer. model number SC*W0'17 Indoor use only

I Ambient temperature 10'C to 40"C (50'F to 104'F)

Storage condition

I Relative humidity 1O%oIo 8Oolo, non-condensing I tvtaximum Altitude 2000m (6562 ft) ('14'F

Pollution degree Power supply

I nc t 00-240V

I Ambient temperature -10'C to 50'C

to 122"F)

humidity lOYo to 95%o, non-condensing I Relative (according to IEC 664-1) 2 | r, 50-60H2 3.0A

Noiselevel l<65d8(A) Externat dimension I WZZ+XH177 xD342 mm Weight I npprox. 6.5 kg (14.33lbs)

Accessories with TSCD-ll I AC power cable, 2 bag supports, 1 cassette of TSCD wafers, 2 water jam repair tools, 2 surface fasteners (fit-in type), 2 surJace fasteners (adhesive tape type), Operating Instructions RS-232 for TSCD lS I|SCD Informaiion System) and barcode reader Communication ports 2 RS-485 (lN and OUTPUT) for TSCD lS

A T

accompanying documents

* Keep dry J

tt

This way up

Fragile, handle

Et-

r--

ia+atnarra

Caution, consult

with care

rd Manufacturer

?r

Keep away

from sunlight

€j' stact<ing rimit by 3 lF-E-Fl ffffi:?'" fSN I serialnumber Ar r+hnrizarl Representative

tEctREPt i"'"-"---^ '' European Community ':

fil] ou*" of manufacture

in the

iql

This oroduct comolies with the Australian EMC framework.

t t ( F

IXT

collection for electrical and /4_ Seoarate electronic equipment (European symbol).

We herewith declare that this product complies with the requirements of EC Directive 2004/108/EC for electromagnetic compatibility in accordance with EN 6.1326-1 , and those of EC Directive 2OO6/42/EC for machinery in accordance with EN 61010-1.

SeCtiOn 2. Physical Description

( {o nq . Cover

. Display . Clamps

. Disoosal box

-9--@=

Used TSCD wafers are automatically discarded in this box.

Figure 1

. Clamo covers

. Slots Tubing is placed in these slots.

. Wafer jam repair holes

Figure 2

. Power switch . AC inlet

. Fuse holders (Fuse 250V 4.0A Time Lag (2 pieces)) . RS485 connectors

A

Oo not connect to the phone line.

. RS232C connector . Handle Figure 3

l

WARNING

. To avoid electric shock, protective grounding conductor in the power cord must be connected to ground.

. Do not remove outer panels. Refer servicing to qualified personnel only. . Disconnect input power before replacing fuse. o To avoid firehazard, replace only with specified type and rated fuse.

o "ALARM" indicator lamp

Lighiens when an alarm occurs.

. LCD DISPLAY Indicates Operating Status, Guidance and Error messages. llluminates when the power is on.

. "EJECT" button Press down this button and the wafer cassette will be released

from its compadment.

. Wafer cassette compadment Compartment housing the wafer cassette.

. "CLAMPS" Set tubing in the front and rear slots and lock the jaws so that the weld cycle can begin. After the cycle is complete, the tubing in the left front slot is connected to the tubing in the

right rear slot. o "RESET" button Press this button to realign the clamps after a weld and to

automatically replace a wafer. This button is also used to reset the machine when the alarm sounds.

. "START" button Press this button after the tubinq has been locked in the cramos. Figure 4

2.5 Accessories 1. AC power cable 2. Bag-support (2 pieces) 3. TSCD wafers (1 cassette) 4. Operating Instructions 5. Wafer jam repair tool (2 pieces) 6. Surface fastener (fit-in type) (2 pieces) 7. Surface fastener (adhesive tape type) (2 pieces)

.

. TSCD lS I|-SCD Information System) TSCD lS is an information system which, when connected to the TSCD-ll, stores all information regarding the welding process and the items being welded.

Figure 5

SeCtiOn 3. operation of rSCD-ll

In this system, two lines of tubing, set parallel to each other, are cut with a TSCD wafer which

has been heated to approximately 300"C (572'F). At this temperature one section of cut tubing

is moved along the heated wafer until it reaches an equal plane with the other section of tubing. Once the two sections of tubing are directly opposite to each other, the wafer returns to its original position so that it is no longer between the two tubing sections. With the wafer lowered, the clamps press the ends of the tubing together and hold them in that position until the PVC has fused, and the joint has cooled enough to be handled. 1. A TSCD wafer which has been heated to approximately 300'C (572"F), cuts two sections of tubing which are held in the clamps (See Figure 64). 2. The tubing section held in clamp #1, is moved along the wafer until it is aligned directly across the tubing section held in clamp #2. Al this point the wafer returns to its original position, the clamps are pushed together, and the two sections of tubing are butted up against each other so that the weld is completed (See Figure 68).

Clamo #2

Clamp #1

TSCD Wafer

1l

(heated to

approximately 300.c (572'Fll

Figure 6,4

Clamp #1

Clamp #2 Figure 68

SeCtiO n 4. General warnings and Gautions

. Never use the system on tubing that is connected to a patient. . Visually check each connection. lf a leak is detected, consider the unit contaminated, and handle appropriately.

I CnUnOruS I o Do not use this system to connect tubing that does not fall within the ranges specified under section 1.2 "Specifications" (P.3). o Do not use the TSCD-ll near a high frequency power source'

. Used wafers are considered as biohazard, dispose of them properly according your local disposal procedures. . Wafers are designed for single use only. Wafers cannot be reused. . A system failure can occur if any foreign matter (solid or liquid) comes in contact with the internal components of the TSCD-ll. lf such a situation occurs, have the unit serviced by an authorised repair service before further use.

. The TSCD-ll is an electro-mechanical instrument designed for reliability. However, electrical or mechanical failures may occur if the TSCD-ll is dropped or handled roughly. PLEASE HANDLE WITH CARE. . A pad of a wafer may stick out of the wafer jam repair holes. Do not touch the wafer jam repair holes because a wafer can damage fingers. . A used wafer jam repair tool is considered as biohazard and must be disinfected using medical alcohol or a chlorhexidine gluconate solution of less than 0.5%.

I CAUnOUS | . Avoid high temperature or humidity during storage. See section 1.2 "specifications" storage condition (P.3).

. Do not store in areas that are subject to vibration, that are excessively dusty, or where the TSCD-ll could be exposed to corrosive gas. o Long term exposure to ultra-violet radiation may cause the external surface

to discolour.

The TSCD-ll is designed for minimum care. Surfaces of the instrument may be cleaned with a damp cloth and a neutral detergent.

I WnnrutHOS | . Turn the power off and disconnect the TSCD-ll before cleaning.

. When cleaning the TSCD-ll, be careful not to spill any cleaning solutions inside the instrument. lf this occurs, do not operate the instrument.

. Professional cleaning and service is required if any liquid (blood, blood product, cleaning solution or other fluid) is spilled into the internal comoonents of the machine.

[Cj]JTlONt-l . Clean the surface of the TSCD-ll with soft clots saturated with medical

alcohol, mild detergent or a chlorhexidine gluconate solution of less than 0.5%. Abrasive solutions or organic solvents shall not be used. . Clean the clamps of the TSCD-ll with a cotton swab saturated with chlorhexidine gluconate solution of less than 0.5%. . Clean the wafer jam repair tool with a cotton swab saturated with medical alcohol, mild detergent or a chlorhexidine gluconate solution of less than 0.5%. Abrasive solutions or organic solvents shall not be used.

4.4 Periodical Maintenance

l

I CRUflOTS | . To assure safe, trouble free service, please have your TSCD-II serviced once every twelve ('12) months or every 20,000 wafers used'

. lf the TSCD-ll is dropped, service is recommended even if there is no outward sign of damage.

. For servicing, please call Terumo.

4.5 Waste and Recycle Electrical and electronic equipment (EEE) and batteries contain materials, components and substances which can be dangerous to the environment and harmful to human health if waste electrical and electronic equipment (WEEE) and batteries are not disposed of correctly'

Waste electrical and electronic equipment and batteries must not be disposed of with the remainder of unseparated waste, but should instead be collected separately. In this way, the environmental impact associated with disposal of WEEE and batteries is reduced and there will be more opportunity for reusing, recycling and recovering WEEE and recycling batteries.

At end of life, please dispose of this equipment according to your local regulations. Contact your local distributor or municipality to know the available collection schemes. The embedded memory back-up CR2032 battery, collected together with this equipment at end of life as WEEE, is to be removed and treated by the recycling centre.

SeCtiOn 5. Procedures for use Please read <IMPORTANT SAFEry INFORMATION> (P.1) and <Section 4. General Warnings and Cautions> (P.8-9) carefully before use.

5.1 Operational Flow Ghart

1.

Turn on TSCD-ll

2.

Align clamps (push "RESET" button)

3.

Place tubing in clamps

4.

Close both clamps simultaneously

5.

Start connection (push "START" button)

6.

Read barcodes (optional)

7.

Connection completed

8.

Check connection

*

I I!

Il

!rr---r-rr

--------l

For next connection * Barcodes can be read before or durinq connection.

5.1.1 System Set-up 1. Connect the system to the power supply (Connect the AC power cable to the AC inlet on the back of the TSCD-ll, and then to the earthed AC socket / or to the TSCD lS (See Figure 7).).

ilr

2. For connection of the TSCD lS to the TSCD-ll, carefully read the lnstructions for use of the TSCD lS and connect the communication cable to the RS-232 plug at the back of the TSCD-ll (See Figure 7).

3. Open the cover. The cover can be easily removed (See section 5.4 "Detachable Cover").

RS232C Power switch Figure 7

10

Power cable

connector

4. Turn the "POWER" switch on (See Figure 8).

When the TSCD-ll is turned on, LCD display illuminates, a self check

starts and 3 beeps will sound when the instrument is operating properly (when using TSCD lS, 4 beeps will sound). The fan starts. The wafer holder is warming up to 70'C to shorlen the welding time (See Figure 9). 6

During warming up of the Wafer Holder portion, maintenance information appears on the display. Each message turns at 3-seconds

LL,..,

iX*gi 9 l:f

Figure B

+ Serial number

intervals. 6. After maintenance information, the display shows wafer holder

temoerature with increment of " * ". When the wafer holder temperature reaches 70'C, beep sounds and the TSCD-ll is ready for operation.

I

Total welds

H:Il"T"i8ffiTagffi +

+

+

l

Weld count by next maintenance

Recommendation of next servicing date

Communication with computer through TSCD lS

I

Software version

Figure 9

7. Place the wafer cassette (See section 5.2 "Replacing the Wafer Cassette" (P.13)).

EAUT|ONI

r Do not block the ventilator on the rear (See Figure '10).

| ruOfeS | . lf the LCD display does not illuminate, turn off the unit, unplug the AC power cable and check the fuses. . A system failure is indicated if the alarm lamp is flashing or the buzzer is sounding continuously.

Turn off the unit immediatelv and call Terumo for servicing.

. If the wafer cassette in the holder is empty, press the "EJECT" button, pull out the old cassette and replace it with a new one (See section 5.2 "Replacing the Wafer Cassette" (P.13).

. lt takes approximately 3 minutes for warming up the

Ventilation siits Figure 10

Wafer Holder at room temperature.

5.1.zGlamp Alignment

.

1. Press the "RESET" button. TAUTIONS-] o The RESET button is not functioning when the wafer holder is warming up.

. The left clamp realigns with the right clamp. The wafer is replaced at the same time. r The clamps shall not realign when they are already aligned.

. Do not press the "RESET" button to align clamps when tubing is present in the slots. TNOTEE . Pressing the "RESET" button with both clamps locked, activates the buzzer and "OPEN CLAMP" is indicated on the display. The clamps will not realign until both clamps are opened and tubing is removed from the slots.

11

1. Set the tubing in the slots.

t NOTES I Tube size Outer Diameter : 3.9 - 4.5 mm

lnner Diameter : 2.9 - 3.'1 mm

Material PVC (polyvinyl chloride) ICAUTIONS |

. Only the tubing with specifications mentioned above should be used.

. Do not use this system to connect two pieces of tubing, of which one, or both are too shor1. lf the tubing placed in the clamp slots does not extend beyond the clamps or if the bag is in such a position as to obstruct the movement of the clamp, the connection may fail in weld strength or may leak.

. Close clamp cover(s) completely until they are locked. Failure to lock the clamp covers may allow them to open during the welding process and may result in tubing welds of inadequate strength. o Do not touch the indicated oarl with the finoers because it is hot (See Figure 11).

Figure 11

'1. Press the "START" button. o After pressing the "START" button, the fan absorbing the smoke will staft, and "HEATING

WAFER" will be displayed on the LCD display. When the wafer reaches the setting temperature, "WELDING" will be displayed and the welding process stafts. After a cerlain time "COOLING" is displayed, the buzzer sounds, the fan stops and the welding cycle is comoleted.

TAUTIOG] . Do not touch the clamps once the weld cycle has begun, as this might srop the welding process.

. After pressing the "START" button, the clamps are locked until the welding cycle is completed. Do not intentionally open the clamps during welding. o Do not pull the tubing during welding. o lf "DEFECTIVE WAFER" is displayed after pressing the "START" button,

press the "RESET" button to stop the alarm. Then press the "RESET" button again to replace the wafer.

2. Open the clamp covers. When "WELD COMPLETE" is displayed and the buzzer sounds, open the clamp covers and take out the tubing from both slots.

t NOTEI . Normally it takes 14 seconds to complete the weld cycle after pressing the "START" button.

12

5.1.5 Weld Alignment Inspection 1. To inspect the weld alignment, leave the weld sealed and rotate the welded tubing 360' and visually inspect how well the outer diameters of the two tubes are aligned at the connection (weld).

2. Compare your weld to those illustrated in Figure 12. ldeally, you should see no misalignment (VIEW A), but differences in the ACCEPTABLE outer diameters of the two sections of tubing may produce an apparent misalignment of the weld. This is acceptable. View B shows a misaligned weld that may be unacceptable. Repeated misalignment of welds (VIEW B) could indicate that service

----VIEW A ACCEPTABLE

E

may oe necessary. ICAUTION |

. Misaligned welds may not be complete. Consider that

VIEW B UNACCEPTABLE Figure 12

the blood product has been exposed to air and change the product expiration accordingly.

5.1.6 Opening the Weld Hold the welded tubing between your fingers with the flattened side of the weld facing up. Open the seal by pinching or rolling the tubing until the fluid pathway opens (See Figure 13).

Figure '13

5.2 Replacing the Wafer Cassette 1. Confirm that the TSCD-ll is not replacing the wafer.

2. Press the "EJECT" button (See Figure 14). The far edge of the cassette will pop up so that it can be seized and pulled out of the compaftment.

3. Position the new cassette so that the label is on top and facing the operator installing the cassette. Slide the cavity at the front edge of the cassette onto the tab at the front edge of the compaftment.

4. Push the back edge of the cassette down until it snaps into place.

WAFER CASSETTE Figure 14

13

Assembling Bag Supports Bag supports are included in the box with TSCD-ll (Figure 15). Support 2

table

Foot Screw

2 sets 4

Figure 15

Necessary to assemble before use as follows.

1. Ovefturn the support table on the flat bench. Place the feet on the support table (Figure 16).

[NOTE-_-]

o Direct the projection of the foot to the outside.

Figure 16

2. Fix the feet with screws (Figure 17). TNOTES I o Take care not to wrench off the bosses with screws during assembling.

. Foot has two (2) holes which shall be guided to the bosses on the support table. Figure 17

3. The Blood Bag supporl has two tips, one on each end. Snap the tips carefully into the respective holders on the TSCD-II (See Figure 18).

FAUTToGI o Do Nor LIFT THE BAG suppoRTs FoR cARRy. o Do not transport the TSCD-ll with the mounted blood bag supporls. . Place the blood bag softly on the blood bag support. Do not drop it onto the blood bag support. . For safety reason, bag supporl can be taken off when impact strikes.

Figure 1B

4. Pull up the blood bag support to take it away (See Figure 19).

Figure 19

1. After opening the cover, it can be detached by pushing it backwards (See Figure 20).

Cover

!

Figure 20

2. To re-attach the cover, hold it in verlical position and slide it down into the hinge sockets on the top at the rear side of the TSCD-ll

-*.*

(See Figure 21).

Cover

'"tG @ -.'r$o Figure 21

I CAUTION | . Do not bring any magnetic sensitive equipment close to

the parts on the TSCD-ll where the magnets are mounted (See Figure 22).

Figure 22

^

5.5 Wafer Disposal 1. Remove the wafer disposal box from the TSCD-ll by drawing it backwards (See Figure 23). ICAUTIONS |

,fu1

. Remove the wafer disoosal box immediatelv when the display indicates "DISPOSAL BOX FULL". Wafers cannot be replaced until full wafer disposal box has

,/n

been emotied.

. The wafer disposal box can be removed any time even if not full. Check if the TSCD-ll is not replacing a wafer when removing a not completely filled wafer disposal oox.

Wafer disposal box

2. Dispose the used wafers by opening and emptying the wafer disposal oox.

Figure 23

lwnnrutruCSl . Follow proper biohazard handling procedures when

disposing the used wafers. Treat all used wafers as potentially nfectious. . Wafers may not be reused. i

TAUT|ON l. Used wafer is hot after replacement. Please do not touch used wafer at once directly. Be sure to set the wafer disposal box on the machine during operation.

3. Inseft wafer disposal box. TAUTIONS-]. The TSCD-ll has ohotosensors on both sides of the wafer disposal box to detect the filling level of the box. Do not block the two holes on the wafer disoosal box. . Insert the wafer disposal box correctly into the TSCD-ll. lf the wafer disposal box is incorrectly inserted, wafer jam

or incorrect fill detection mav occur.

5.6 Cleaning Procedure Before using other cleaning or decontamination method except those being mentioned in this instruction, call Terumo for avoiding the TSCD-ll from damage caused with improper methods. The TSCD-ll is designed for minimum care. Surfaces of the instrument

may be cleaned with a damp cloth and a neutral detergent or a disinfectant such as medical alcohol or an aqueous solution of chlorhexidine gluconate. 1. Turn off the "POWER" switch and unplug the AC power cable from the AC outlet.

2. Clean the surfaces of the instrument with a soft cloth saturated with a neutral detergent or medical alcohol or an aqueous solution of chlorhexidine gluconate of less than 0.5%.

3. Clean the clamps with a cotton swab saturated with medical alcohol or an aqueous solution of chlorhexidine gluconate of less than 0.5%.

4. Clean the wafer jam repair tool with a cotton swab saturated with medical alcohol, mild detergent or a chlorhexidine gluconate solution

of less than 0.5%o. to

5.7 Replacing the Air Filter Periodical reolacement of the air filter is recommended and can be done as follows:

1. Pull out the filter case from the bottom of the TSCD-ll and take awav present filter in the filter case (See Figure 24).

2. Set new air filter in the filter case (See Figure 25).

Figure 24 Filter case

TAUTION-] . Set the new air filter carefully and do not bend it or let it slip out of the filter case.

3. Insert the filter case in the TSCD-ll .

I NOTES | . lf excessive smoke comes out of the TSCD-ll durino welding, replace the air filter.

. Recommend to reolace the air filter each 2000 welds or Craws

after 1 month.

. New air filters and/or more information on filter

Air filter

Figure 25

replacement is available from Terumo's personnel.

When the "S" mark appears on the display, the parameter setting mode

can be selected by pressing the "START" button for 2 seconds. Parameters are changed using "START" and "RESET" buttons.

Select language

1. Press the "RESET" button and "Language" is indicated on the display. The display indicates the current language. 2. Change the language by pressing the "START" button (e.9. English,

French, German, Spanish, ltalian, Dutch, Swedish, Danish, Norwegian, Finnish, Portuguese and Greek are available.). 17

5.8.2 Buzzer Volume Buzzer volume can be selected from 8 levels.

1. Press "RESET" button lill "Buzzer Volume" is indicated on the display. Display indicates current volume.

2. Change the volume by pressing the "START" button.

Select Eurooean or American date format. 1. Press "RESET" button till "Date Configuration" is indicated on the display. The display indicates current date format 2. Change the date format by pressing the "START" button.

Select the activation of Terumo Information System connection.

1. Press "RESET"'button till "lS connection" is indicated on the display. The display indicates the current status of the lS activation.

2. Change the lS activation status by pressing the "START" button. I NOTEI . When changing parameter of lS activation, Hardware must be reset. Turn the power off after exiting parameter setting mode and turn the power on again.

Check or reset the number of welds. '1. Press the "RESET" button till "Counter Reset" is indicated on the

display. The display indicates the current weld count.

2. Reset the weld count by pressing "START" button for 2 seconds.

5.8.6 Exit from Parameter Setting Mode 1. Press "RESET" button, then "Exit SETTING MODE?" is shown on the display.

2. Press "START" button to save all oarameters and exit from Parameter Setting Mode.

18

t:: l

The wafer jam repair tool, a fit-in type surface fastener and an adhesive tape type surface fastener are included in the box with TSCD-ll (See Figure 26). Install the wafer jam repair tool to TSCD-ll in the manner shown below (otherwise it may be lost).

fastener (adhesive tape type) Figure 26

'1. Put the fit-in type sur{ace fastener into the wafer jam repair tool by inserting it between the projections of the tool (See Figure 27). ICAUTION I

. Be sure the direction of the fastener is right against the tool, otherwise it cannot be attached to the tool.

2. Attach the adhesive tape type surface fastener on a place that does not obstruct you when using the TSCD-ll . Before attaching the adhesive tape type surface fastener, the surface must be wiped using medical alcohol and dried thoroughly. Attach firmly so that no clearance gap is made between adhesive surfaces of the fastener and

TSCD-II.

Figure 27

FAUTIONI . Don't attach the fastener to the wafer disposal box, the clamps, the filter case, the "START" button, the "RESET" button, the "EJECT" button, the "ALARM" indicator lamp or to the back of TSCD-ll (See Figure 1-4 and24.

3. Push the wafer jam repair tool (with sur-face fastener) on the surface fastener attached to the TSCD-ll .

19