Technical Reference Manual
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Datex-Ohmeda S/5™ FM Service Menu Technical Reference Manual Slot
All specifications are subject to change without notice. CAUTION: U.S. Federal law restricts this device to sale by or on the order of a licensed medical practitioner. Outside the USA, check local laws for any restriction that may apply. Document no. M1022499-2 Month, 2004
Datex-Ohmeda Inc. P.O. Box 7550 Madison, WI 53707-7550, USA Tel: +1 608 221 1551 Fax: +1 608 222 9147 www.us.datex-ohmeda.com mailto:[email protected]
Datex-Ohmeda Division, Instrumentarium Corporation P.O. Box 900 FI-00031 DATEX-OHMEDA, FINLAND Tel: +358 10 39411 Fax: +358 9 1463310 www.datex-ohmeda.com 2004 General Electric Company. All rights reserved
Table of contents
Table of contents
1
Introduction
1
Frame
3
1.1 1.2
1.3
1.4
Memory... 3 Network... 4 1.2.1 Network Status... 4 1.2.2 Network Config... 6 1.2.3 Ethernet... 6 1.2.4 WLAN... 7 1.2.5 Socket... 9 MemCards...10 1.3.1 Status...10 1.3.2 Communication... 11 1.3.3 PCMCIA Board...12 Power supply...13 1.4.1 WPM Battery...14
2
Display
18
3
Keyboard
19
3.1
4
Parameters 4.1 4.2 4.3 4.4
4.5
5
38
Country Settings...39
Service Log 6.1
21
Gas unit...21 4.1.1 General...22 4.1.2 Gases...23 ECG Module...24 4.2.1 ECG Setup...25 PSM STP...26 4.3.1 Calibrations...28 NIBP Module...29 4.4.1 NIBP Demo...30 4.4.2 Calibration...31 4.4.3 Safety Valve...32 4.4.4 Pulse Valve...33 4.4.5 Buttons/Leds...34 4.4.6 Pneumatics...35 4.4.7 Watchdog...36 DIS Interfacing...37
Set/Test 5.1
6
Keyboard Log...20
40
Maintenance... 41 6.1.1 Planned Maintenance...42 6.1.2 Repair...42
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Table of contents 6.1.3
Upgrade...43
7
Record Data
44
8
Remote Access
45
9
SW Download
46
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Service Menu
Introduction The monitor has a Service Menu, which is a useful tool to examine monitor functions and to troubleshoot in case a fault occurs.
Service Menu structure
Service Menu Memory Network Frame
Conf ig Ethernet WLAN
WLAN Conf ig
Sockets MemCards
PCMCIABoard
Power Supply Display
WPMBattery
Key board
Key board Log
Parameters
Gas Unit
General Gases
ECGModule
ECGSetup
PSMSTP
Calibrations
NIBPModule
NIBPdemo
DISInterf acing
Calibrations Saf ety v alv e Pulsev alv e Buttons/Leds
Country Settings
Serv ice Log
Maintenance
Record Data Remote Access SW Download
Pneumatics Watchdog PlannedMaint. Repair Upgrade
servmenu struct03 FM vsd
Set/Test
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Service menu NOTE: The Service Menu pictures are for reference only. Details on the menu page can vary depending on the software version. 1. Press the Monitor Setup key. 2. Select Install/Service (password 16-434). 3. Select Service (password 26-23-8).
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Service Menu
1
Frame
The Frame menu includes service menus common for the frame.
1.1
Memory
A service menu to check the status of the memory used in CPU board of the monitor. Test Memory tests the condition of the EEPROM/ Flash memory component of the CPU board. If the result of the test is Fail, see section “Error messages.” Test SRAM tests the Static RAM memory of the CPU board in a similar way as the EEPROM/Flash memory. If the result of the test is Fail, see section “Error messages.” Real time clock test is run at every start up and also during the operation of the monitor. If the result of the test is fail, the battery for SRAM timekeeper should be replaced.
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1.2
Network
1.2.1
Network Status
The Network Status view shows the general status of the network Location ID: Monitor’s location given at the setup. DRI level: Shows the selected level of network communication. The network communication is set according to the used network software (e.g. S-CNET01) Interfaces: The field indicates if there is a connection to the S/5 Network Gateway Interface: The field indicates active network interface (None/Ethernet/WLAN) Connections: Names of subnet id:s connected The filed represents the subnet status menus, i.e. shows the connected subnets. The three first connections are reserved permanently for DatexOhmeda Central, and the fourth is reserved for another subnet, e.g. Datex-Ohmeda S/5 Arrhythmia Workstation.
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Service Menu
Subnet Status The Subnet Status view gives more accurate information of the different subnet id:s connected. All four Subnet status menus have similar structure. The number of different packets transmitted and received by the monitor are shown in the columns below Tx and Rx. The packet types are described in the table below. Waveforms: Waveform data Phys. data: Physiological numerical data Alarms: Alarms, alarm profiles and alarm limits Link mgmt: Network management messages Record K: Record Keeper data MonToMon: Monitor-to-monitor communication related data Printer: Printing data and control messages File Op.: File operation messages, saving and loading of cases Service: Maintenance and service Modes: User mode data Indics.: Remote indications sent to monitor RemoteEv: Remote events Data server: Packets of the data server (Arrhythmia Workstation) Packets total: Total number of packets sent/received Bytes total: Total number of bytes sent/received T-o Number or resendings InE Received faulty packets LenE Erroneous packet length Dupl Same packet received as a duplicate
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1.2.2
Network Config
The DRI Level is for setting the monitor's network communication. The network communication is set according to the used network software (e.g. SCNET01). Network software S-CNET01 ->DRI Level = 2001 Network software S-CNET02 ->DRI Level = 2001 or 2002(WLAN) Network software L-NET03 ->DRI Level = 2003 Virtual Plug ID indicates the monitor’s location (Network ID). Virtual Plug ID is automatically defined when downloading the WLAN option to the monitor.
1.2.3
Ethernet
The Ethernet Status view shows the general status of the ethernet network communication. Driver: Ethernet chip name (DP83902, DP83907) Cable: Indicates if the ethernet cable is connected EthernetAddr: Monitor’s ethernet address Speed: Indicates the current ethernet communication speed. The service data related to the ethernet status view is described on the next page.
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Service Menu
1.2.4
WLAN
Driver: WLAN driver chip name Connection indicates the state of the WLAN connection. Ethernet Addr: Ethernet address of the used WLAN card AP MAC: Ethernet address of the access point where the monitor is currently connected. Signal Quality indicates the quality of the radio signal between the monitor and the access point (0…100%) Channel is the WLAN channel configured to the access point where the monitor is currently connected Speed indicates the current communication speed with the access point. RoamCounter Occurred roamings between access points Reset Counter * Network ID: Identifies the used WLAN network. Firmvare version: * Firmware date: * Statistics (Packets, Bytes, Errors, Fails, Buffer) shows the WLAN communication related statistics * WLAN PCMCIA card related information
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AP List Access Points: shows the access points (max. eight) which are visible for the monitor. CH is the WLAN channel configured to this particular access point NL indicates the noise level of the used channel (0…100%) SL indicated the signal level of the used channel (0…100%)
WLAN Config Network ID is for setting the correct WLAN network ID name. WEP Algorithm is for setting the level of the encryption (width of encryption key) used for WLAN security (40 bit or 128 bit). Key ID is for choosing the used encryption key. Encryption key is for setting the encryption key. NOTE: When selecting 40bit encryption, enter 10 Hex digit characters (divided into2 fields). When selecting 128bit encryption, enter 26 Hex digit characters (divided into2 fields). NOTE: Use only hexadecimal characters. NOTE: For all the monitors and access points in the same WLAN network the previous parameters must be set to be the same.
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Service Menu
1.2.5
Socket
For factory use only.
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1.3
MemCards
1.3.1
Status
Present and Active indicate the status of the PCMCIA controller on the CPU board. Possible values are YES and NO. ROM indicates the status of the ROM memory. Possible values are OK and ERR. RAM indicates the status of the RAM memory. Possible values are OK and ERR. PCMCIA indicates the status of the PCMCIA controller. Possible values are OK and ERR. EEPROM indicates the status of the EEPROM memory. Possible values are OK and ERR. SLOT1 and SLOT2 indicates the left hand slot and the right hand slot, respectively. Card type indicates whether the card is MENU or DATA card. If duplicated card is inserted, type DUPL. File system indicates the type of the used memory card. The only supported file system is ATA. If a memory card using another file system is used, the message UNKNOWN is shown. If the card is poorly attached, the message LOOSE is shown. Card size indicates the total amount of the disk space in the card in kilobytes. Card used indicates the total amount of the used disk space in the card in kilobytes. Card full indicates whether the all disc space in the card is used. Possible values are YES and NO. Card empty indicates the lack of menu files in the MENU card or no files in the DATA card. Possible values are YES and NO. Read error indicates whether the reading from the card has failed. Possible values are YES and NO. Write error indicates whether the writing to the card has failed. Possible values are YES and NO. All values can be '- - -' to indicate 'No data available'.
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Service Menu
1.3.2
Communication
Interface status indicates the status of data link between the monitor and memory module. The status should always be on ACTIVE. If status blinks between ACTIVE and CLOSED, a communications error has occurred: remove module briefly, and insert it back to the monitor frame to check if error disappears. Message types indicates the type of data packets that have been sent (Tx) and received (Rx) since last monitor start. Data types are listed on the lines below Message types text. Record K indicates the communication between the Monitor and Record Keeper. File Operation indicates the operations of Patient data. Service indicates the memory module operations. Modes indicates the User Mode operations. Module status indicates the number of sent/ received data packets that relate to the memory module status. Packets total indicates the total amount of data packets that have been sent/received since last monitor start. Bytes total indicates the total amount of data bytes that have been sent/received since last monitor start. The last four lines indicates transmission errors: Time-outs indicates the number of time-outs that have occurred in memory module data transmission since last monitor start. Chksum err indicates the number of checksum errors in data packets from memory module since last monitor start. Length err indicates the number of data packets with erroneous length from the memory module since last monitor start. Duplicated indicates the number of duplicate data packets from the memory module since last monitor start.
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1.3.3
PCMCIA Board
Chip type is the type of the PCMCIA controller chip used. Number of slots is the number of PCMCIA card slots in use (0, 1 or 2). Slot A/B active and Drv Active indicate if the PCMCIA card slot is active. Driver Ptr, Detect Int and PC-card Int: PCMCIA card driver software related data. PcCard info: General PCMCIA card related information.
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Service Menu
1.4
Power supply
The menu shows voltages and temperature measured by the DC/DC board and CPU board.The values in the column under Mean are the mean values of last one second, the Min column shows the minimum mean value, and Max column the maximum mean value of the voltages and temperature measured during the current power ON. The voltages and currents are measured by the DC/ DC Board, except the four lowest under heading CPU Board A/D, which are measured by the CPU Board. +5V and +3.3V values come thus both from DC/DC Board and CPU Board. System power and Module power are calculated by the DC/DC Board. ACDC
AC/DC converters output voltage, used as monitor input voltage when mains cord is connected. Range when present: 15.25…16.55V (Note: this includes the measurement inaccuracy). EXTDC External DC input voltage, can be used as monitor input when present, if mains is not connected. Range when present: 10…16.5V Bat1 Battery A voltage measured at DC/DC Board. Range 9…12.6V for Li-ION battery Bat2 Battery B voltage measured at DC/DC Board. Range 9…12.6V for Li-ION battery VSYS System voltage at DC/DC Board. This is the monitor input voltage measured at DC/DC Board after input voltage selection. Range 9…16.5V. VBOOST Boost converters output voltage at DC/DC Board. Boost converters input is VSYS, which is raised to higher level for module bus voltage and battery charging, if needed. Range 14…16V VMOD Supply voltage for modules. VBOOST is fed through a circuit breaker to VMOD. Range 13.8…16V I/O_VMOD Module bus supply voltage that can be connected to Multi I/O Connector at the rear of the monitor. Connecting depends on the DC/DC Board software. Range when connected: 13.8…16V +5V At DC/DC Board. Range 4.8...5.3V +3.3V At DC/DC Board. Range 3.15…3.45V Mod Current Current from module bus voltage VMOD. Depends on module configuration. SYS Current Current from system voltage VSYS. Depends on system configuration and battery charging. Bat current Current from or to the battery selected (discharge or charge). Measured at DC/DC Board. Depends on system configuration and battery charging. System power Power from VSYS, calculated by DC/DC Board software. System power = VSYS * SYS Current Module power Power from VMOD, calculated by DC/DC Board software. Module power = VMOD * Mod Current Power Temp Power supply unit temperature, measured at DC/DC Board Therm Not CHG This is subject to change. Dummy CHG This is subject to change CPU Board Temp Temperature measured at CPU Board VSYS_OUT VSYS that is connected to CPU Board and Backlight Inverter by a FET. Measured at CPU Board. Range 9…16.5V +3.3V Measured at CPU Board. Range 3.15…3.45V. +5V Measured at CPU Board. Range 4.75…5.25V
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1.4.1
WPM Battery
Batts This page contains information that is related to the batteries and power supplies. Power supply part is practically the same as in power page. Battery information includes also data measured by the smart batteries themselves and transmitted to the DC/DC Board via SMBus. SMBus is System Management Bus, a two-wire interface closely resembling I2C. SMBus is used for battery communication. Batts information section of the page has two columns: Batt1 for battery A data and Batt2 for battery B data. NOTE: Text “SMBus” above Current (SMBus mA) -line shows which battery is connected to the SMBus. Dev. Chem. Device chemistry. FM monitor supports only LiION batteries. Full Cap.(mAh) Full charge capacity of the battery; capacity of the battery when it is fully charged. Rem. Cap. (mAh) Remaining battery capacity. Rel. St. of CHG (%) Relative state of charge of the battery. Expressed as a percentage of Rem. Cap. (mAh) / Full Cap.(mAh). Current (SMBus mA) Battery current (discharge or charge) measured by the battery, transmitted via SMBus to DC/DC Board. Voltage (V) Battery voltage measured at the DC/DC Board Voltage (SMBus mV) Battery voltage measured by the battery. ICHG Charging power level for charger hardware, this bit can have values high or low. High is normal setting, low is used when DC/ DC Board software determines to limit the total power consumption of the monitor by limiting the charging power (i.e. due to high temperature). Batt Temp (×C) Battery temperature. For the battery connected to SMBus this is real time data. Max Batt Temp (PMC) This is subject to change. Max Batt Temp (SMBus)Maximum battery SMBus temperature from entering the service pages. For the battery connected to the SMBus max values are updated in real time. Other measurements See explanation in previous power pages.
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Service Menu
Smart Batt1, Smart Batt2 Clear Temp Maxs This command is useful only when WPM Battery Batts view is selected. Clear Temp Maxs command clears the maximum values of Batt Temp (SMBus) and Batt Temp (PMC) Note: Power temp and CPU temp maxs are not cleared. These menus give additional battery information via SMBus. Batt1 stands for Battery A, Batt2 for Battery B. If Smart Battx is selected for the battery connected to the SMBus, the menu contains the following:
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Smart Batt1 Battx information from SMBus (all this information comes from the battery via SMBus) Temperature Battery temperature Voltage Battery voltage Current Battery current (discharge or charge) Avg. Current Rolling average of the battery current Rel. St. of CHG (%) Relative state of charge of the battery. Expressed as a percentage of Rem. Cap. (mAh)/ Full Cap.(mAh). Abs. State of Charge Absolute state of charge. Expressed as a percentage of Rem. Cap. (mAh)/ Design Capacity (mAh). Remaining Capacity Remaining battery capacity (mAh). Full charge capacity Capacity of the battery when it is fully charged. Cycle Count Number of cycles the battery has experienced. A cycle is an amount of discharge approximately equal to the value of Design Capacity. The exact value of cycle count threshold is stored in the battery permanent memory. Design Capacity Theoretical capacity of a new battery. Design voltage Theoretical value for nominal voltage of a new battery. Manufacture Date (DD:MM:YY) The date the battery pack was manufactured Manufacturer Name Acronym of the battery pack manufacturer name Device Name Battery pack model name Device Chemistry Battery chemistry of the cells used. Therm. Status from charger Status of the battery thermistor or code resistor read by Smart Battery Charger IC. The thermistor or code resistor is always connected to the charger whenever the corresponding battery is connected to the charger and SMBus.
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Service Menu
Smart Batt2 If Smart Battx is selected for the battery NOT connected to the SMBus, the menu contains the following: Battx information from Memory and PMC (This information comes from the DC/DC Board memory or is measured by the DC/DC Board. SMBus data in this menu is not real time, because this battery is not connected to the SMBus). NOTE: This page may not contain information if SMBus has been connected only to the other battery. Page can be updated by battery disconnection and reconnection, if desired. Rel. St. of CHG (%) Relative state of charge of the battery. Expressed as a percentage of Rem. Cap. (mAh) / Full Cap.(mAh). Remaining Capacity Remaining battery capacity (mAh). Full charge capacity Capacity of the battery when it is fully charged. Design Capacity Theoretical capacity of a new battery. Design voltage Theoretical value for nominal voltage of a new battery. Manufacture Date (DD:MM:YY) The date the battery pack was manufactured Manufacturer Name Acronym of the battery pack manufacturer name Device Name Battery pack model name Device Chemistry Battery chemistry of the cells used. Batt1 voltage Battery A voltage measured at the DC/DC Board Batt2 voltage Battery B voltage measured at the DC/DC Board Batt current Battery current (discharge or charge) for the battery connected to SMBus. Measured at the DC/DC Board. Batt Not CHG Temperature This is subject to change
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